Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : ASML Holding NV -- Ignore unavailable to you. Want to Upgrade?

To: niek who wrote (1348)	2/26/2007 12:34:33 PM
From: niek	Read Replies (1) \| Respond to of 43559

Press Releases ASML Sets Two New Lithography Milestones at SPIE SAN JOSE, Calif., February 26, 2007 – ASML Holding NV (ASML) today announced that they will present record imaging results for immersion and extreme ultraviolet (EUV) technologies during SPIE Microlithography 2007. ASML will show two sets of breakthrough lithography results at the annual conference including 37-nm dense lines produced on the TWINSCAN™ XT:1900i, and both 32-nm dense lines and 32-nm dense contact holes from ASML full field EUV Alpha Demo Tools (ADT). "Our customers require new technologies to get them beyond the 45-nm node," said Martin van den Brink, executive vice president marketing and technology at ASML. "The industry's first full-field EUV results from a customer site, coupled with the best resolution achieved to date for immersion demonstrate how our technologies continue to support our customers and their respective roadmaps." The industry adoption of immersion lithography and ASML's leadership in advanced exposure technologies is proven by more than 36 immersion systems shipped by ASML. ASML’s TWINSCAN XT:1700i immersion scanner is now ramping for production at customer sites. ASML's 37-nm results were accomplished on the TWINSCAN XT:1900i. This next generation immersion system features the same advanced catadioptric lens design as the XT:1700i, but with better resolution capability due to the higher numerical aperture of 1.35. The throughput has increased to 131 wafers per hour. In addition to the immersion results, ASML will also present 32-nm dense lines and 32-nm dense contact holes using EUV lithography. This technology still promises to give the most cost-effective and extendible option for production at the 32-nm node and beyond. ASML was the first to ship full field EUV systems to customers, and currently has orders for three EUV pre-production systems. The first shipments are planned for 2009.