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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Saturn V who wrote (228624)	3/21/2007 12:58:54 AM
From: pgerassi	Read Replies (1) \| Respond to of 275872

Dear Saturn_V: Well the current mobile Turions and Meroms that have no IHS on them say you are wrong. You can see the thickness of the die on them because its exposed. Your looking for things evidently missed the backside coating that is also evident on these packages. So I say you are well off of the norm. Empirical evidence trumps ivory tower suppositions. That is the trouble with young folk these days. They can't seem to use a reality filter to separate the PR boasting from the real deals. Without that back of the envelope or napkin depending on your age, many of these things that shouldn't stand up in the light of day get missed being taken out with the other trash. You claimed that 25um wafers were used in CPU processing. I showed you the specs of the wafers being supplied. You even missed the obvious mistake of a 25nm thick 300mm wafer. 25um 300mm wafers can be made, but they can't be handled using the normal pod methods, they are just too fragile. One of the ways SOI wafers are made uses a thick base wafer and a thin top wafer that has a thin oxide layer implanted on one side and then bonded to the thicker wafer. The other of course directly implants the oxygen at a certain depth. Its harder to do, but results in a stronger wafer. So I find your methods full of errors and poor judgement. I will not respond to you further on this issue either. Pete