To: etchmeister who wrote (3655 ) 4/25/2007 1:50:05 AM From: etchmeister Read Replies (1) | Respond to of 3813 Switch to copper? To: etchmeister who wrote (1820) 4/25/2007 1:36:11 AM From: etchmeister of 1821 Where does the analyst community stand on this matter - probably lost - and useless. PSC: 8-inch DRAM production capacity to drop 25% Printer friendly Related stories Comments Email to a friend Latest news Hans Wu, Taipei; Rodney Chan, DIGITIMES [Monday 23 April 2007] Powerchip Semiconductor Corporation (PSC) president Brian Hsieh said today that 25% of the 8-inch capacity in the industry will exit the DRAM market in 2007 because of 8-inch fabs' inability to catch up with the demand for 70nm manufacturing processes and 1Gb DDR2. Hsieh said the 70nm processes and 1Gb DDR2 are two important aspects for DRAM makers, and it will be very difficult for existing 8-inch fabs to achieve either of the two. Because of the departure of a significant portion of 8-inch fabs from DRAM production, Hsieh estimates a reduction of almost 400,000 8-inch wafers in monthly capacity. With growing demand for DRAM in the second half and reduced capacity, Hsieh expressed optimism for the DRAM market in the second half. PSC spokesman Eric Tang said the 70nm processes will help DRAM makers reduce their costs and accelerate the rise of 1Gb DDR2 to becoming the market mainstream. Hsieh predicts that 1Gb DDR2 will become the mainstream in the fourth quarter of 007. Tang revealed that PSC will migrate to a 70nm process technology in the second quarter, volume producing 512Mb DDR2. The company will also start test production for 1Gb DDR2 and 8Gb multi-level cell (MLC) flash products, Tang said, adding that yield for PSC's 70nm test production has reached 80%. Hsieh said the 70nm process technology is expected to lower PSC's production cost for 1Gb DDR2 to US$3.50. Hsieh said market prices for 1Gb DDR2 will be about US$8 when it first hits the market, but prices will gradually fall to US$6.