SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?


To: Not a Short who wrote (238979)8/17/2007 12:53:27 AM
From: pgerassiRead Replies (1) | Respond to of 275872
 
Dear Not_a_short:

I used C difference between case temp and CPU temp divided by the thermal resistance of my HSF according to its specs, 0.39C/W. That directly measures thermal output. And that assumes a clean HSF. A dirty one has a higher thermal resistance and thus a lower TDP at any given temperature difference.

Pete



To: Not a Short who wrote (238979)8/17/2007 10:22:40 AM
From: wbmwRespond to of 275872
 
Re: You lost me on variable TDP numbers. Are you measuring power draw and calling it TDP?

Pete's version of TDP does not exist in any of the datasheets. I have pointed this out to him several times, yet he insists that his version is superior to Intel's or AMD's definitions.