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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Tenchusatsu who wrote (239026)	8/17/2007 11:15:51 PM
From: pgerassi	Respond to of 275872

Dear Tench: It is you that doesn't get it! I choose the definition that has the most usefulness, not one used just by marketers. Too many misuse and misconstrue terminology. Few use Thermal Design Point since its abuse by the Intel definition. If that definition, then as was claimed by others, there should only be one covering what is necessary to design the heat removal system. Yet even in the newest AMD documents, there are 8 listed, one for each if 4 P-States, one for Stop Grant in the maximum P-State, one for Stop Grant in the minimum P-State, one for C2 and one for C3. What they are listing are maximum thermal dissipation powers under each set of conditions. So my definition is more accurate with how its being used. If TDP is truly used as its being defined, it would be the maximum thermal power dissipation of the package in the worst case. In mathematical terms, an absolute upper bound constraint on thermal power being dissipated. This is then plugged into various calculations in order to design a heat removal system to keep the CPU die and the rest of the package within the SOA, Safe Operating Area, usually well within. The other "TDPs" might be nice to know, but they don't figure into the design of the heat removal system. So they are not design points at all, but additional thermal dissipation powers under varied operating modes. Under P4 (P-State 4) Idle conditions, the CPU will not generate more than XX.XW in thermal output. Mostly they are used for marketing (bragging rights). Saying otherwise is disingenuous. Pete PS: Results 1 - 10 of about 23,400,000 for "earth flat". So by your method, the earth being flat is true because it has more hits than Results 1 - 10 of about 2,270,000 for "earth sphere". Just goes to show that method is quite flawed.