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To: etchmeister who wrote (5687)	3/12/2008 11:50:14 PM
From: etchmeister	Read Replies (2) \| Respond to of 5867

PSC adds two more 12-inch fabs Printer friendly Related stories Comments Email to a friend Latest news Hans Wu, Taipei; Esther Lam, DIGITIMES [Wednesday 12 March 2008] Despite the DRAM industry still experiencing a trough, Powerchip Semiconductor Corporation (PSC) yesterday participated in a groundbreaking ceremony for its two new 12-inch fabs in Hsinchu, Taiwan. By adding the new capacity, PSC, together with Elpida Memory and Rexchip Electronics, will deliver a monthly DRAM capacity as much as 500,000 wafers per month. PSC will invest NT$250 billion (US$8.2 billion) in the two new 12-inch fabs, P4 and P5. Both fabs will commence DRAM production on 50nm. By adding the new capacity from P4 and P5, PSC will house a total capacity of 120,000 wafers per month. PSC said it is now not a good time to produce NAND flash, so the company will not produce NAND flash at the new fabs. The company would rather focus NAND flash production at its other two 12-inch fabs, P1 and P2. P4 and P5 were originally planned for NAND flash production. Regarding capacity ramp-up at Rexchip Electronics. PSC company chairman Frank Huang said R1 already houses a monthly capacity of 70,000 wafers and that construction for R2 will be completed by year-end of 2008. R2 is planned to house a monthly capacity of 30,000 wafers, meaning that the total monthly capacity at Rexchip Electronics will reach 100,000 wafers in 2008. As of 2007, Huang indicated that PSC has invested NT$110 billion in Rexchip Electronics and the company will add another NT$160 billion in the joint venture in 2008.