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To: etchmeister who wrote (3714)	7/10/2008 2:29:46 PM
From: gugie	Respond to of 3813

Point being the author claimed you couldn't do sub 65nm without immersion...clearly this is not the case. Makes you wonder if these guys just spout back what they read or hear without thinking...

To: etchmeister who wrote (3714)	7/10/2008 6:21:50 PM
From: Cary Salsberg	Read Replies (1) \| Respond to of 3813

Top of my head, no real expertise, but I believe "critical dimensions" are "critical dimensions." 65 and 45 nm are the same for memory and logic. The difference is that logic moves on the road map steps, 65 to 45, etc., but memory makes many more incremental steps, e.g. 65 to 60 to 55 to 50 to 45, etc. I suspect the clever process technology INTC achieved to be able to use dry litho at 45 nm might not be financially feasible to develop for many small increments.