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Politics : RAMTRONIAN's Cache Inn -- Ignore unavailable to you. Want to Upgrade?

To: NightOwl who wrote (14013)	7/17/2008 4:12:45 PM
From: NightOwl	Read Replies (1) \| Respond to of 14464

From another SEMICON article on a panel discussion reported at: Improving the Way We Change Materials Patterning and new materials are probably the greatest grand challenges in semiconductor processing for the next 3-5 years, according to a panel at a Praxair event held Tuesday at SEMICON West. Laura Peters, Editor-in-Chief -- Semiconductor International, 7/17/2008 8:00:00 AM * The panel discussed the critical interaction between front-end and back-end groups now that metals are being used at the transistor level and increasingly significant issues occur between Metal 1 and the contact. “Topography from the front end impacts the patterning ability on the back end,” Watts said. He added that the short-loop processing that drives learning is very useful and necessary, but when it comes to multi-level interconnects, learning on fully integrated wafers is necessary too. “Often we get into problems there,” he said. Sandhu discussed how NAND is the clear driver for scaling, while DRAM is the driver for 3-D structures and high-k materials. “We are looking at needing a new high-k material every three years, and right now the magic material for the next generation doesn’t seem to exist. A nanomaterial is the leading contender for next-generation NAND cells,” he said. * semiconductor.net Maybe I should send Micron a few suggestions. <Hoo><Hoo><ack> 0\|0