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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (9177)	10/22/1997 12:08:00 PM
From: davesd	Read Replies (1) \| Respond to of 70976

Brian, the reason no one is in mass production at .25u is because the yeilds are low. The more complex the technology gets the lower the yeilds get. If the yeilds stay the same as 200mm, then we will get 2.25x increase in output. dave

To: Proud_Infidel who wrote (9177)	10/22/1997 12:16:00 PM
From: Eric Sandeen	Respond to of 70976

The 2.25x figure comes straight from geometry for the area of the wafers. (Area = Pi * R^2) If you need help. :-) So, comparing 200 and 300 mm dia wafers, Pi(150^2) ------------ = 2.25x the area Pi(100^2) However, achieving uniform processes (deposition, etch, etc.) across the larger area is one of the technical challenges for 300mm design. It seems reasonable that it's harder to maintain the process out towards the edge of the larger wafer. So, I think that there is probably some truth to the statement that output may not be increased by 2.25 immediately. This is just a hunch of mine - I haven't designed any chambers lately. :-) But hey, even 2x output for 40% cost increase (if that's correct) doesn't sound too bad. -Eric