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To: JRGEE who wrote (6032)	10/23/1997 5:32:00 PM
From: PAinvestor	Read Replies (2) \| Respond to of 25960

AS if we didn't have enough to gloat about. Check this out in todays semiconductor business news in a speech by the Sematech Chief at the Dataquest conference today. An excerpt: "Among other major technical challenges in 0.1-micron and below wafer processing is selecting a new lithography technology - X-ray, direct write electron beam or extreme ultraviolet - to succeed venerable optical tools, Melliar-Smith said. "Excimer laser deep UV at 193-nanometer wavelength will carry us down to 0.13- to 0.1-micron feature size. Some have proposed calcium flouride excimer lasers with smaller wavelength - but there isn't enough calcium flouride material in the world to make production tools." PAinvestor