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To: Tsaen Wang who wrote (6325)10/24/1997 3:50:00 PM
From: Jolo  Read Replies (1) | Respond to of 25960
 
**** off topic *****
APM/CYMI boat
wow, what are the odds...
add me to the misery. None of you guys own TXN??



To: Tsaen Wang who wrote (6325)12/18/1997 6:20:00 PM
From: BillyG  Read Replies (1) | Respond to of 25960
 
Silicon Valley Group reported last week that it shipped a Micrascan III deep-ultraviolet step-and-scan lithography system
to LSI Logic at the end of last month. LSI Logic last year bought a Micrascan II system from SVG. G. Dan Hutcheson,
president of industry research firm VLSI Research, said, "DUV step-and-scan technology has been increasingly adopted
by a wide range of manufacturers due to its excellent process results. Its superior CD control yields chip makers much faster
devices, dramatically increasing the market value of a company's production. It also allows larger chips, which helps to
further the industry's progression along Moore's famous curve. SVG pioneered this rapidly expanding lithography market
and is the leader in providing the industry with these advanced tools, which are required to keep chip makers on top of the
competitive curve."

SVG Lithography division president Edward Dohring noted that the Micrascan III is well-suited for LSI Logic's advanced
ASIC manufacturing. "LSI Logic chose the system for its sub-0.25-micron production capabilities, as well as its superior CD
control and overlay features," said Mr. Dohring. "These attributes result in increased yields without sacrificing critical
performance parameters--making the Micrascan III an ideal solution to LSI Logic's advanced processing needs." Mr.
Dohring added that SVG's ability to quickly deliver the tool and LSI Logic's success with its existing Micrascan II system
were key factors in the purchasing decision.

LSI Logic will use the Micrascan system for its new G11 product family--the company's 11th-generation ASIC technology.
Featuring an effective gate length of 0.18-micron, the G11 product family empowers designers to simultaneously improve
performance, reduce chip size and reduce power consumption.

-------------------
Hayward, Calif.'s Etec Systems released the Mebes 4500S, a new version of the company's existing system, enhanced to
produce pilot 0.18-micron devices. Two beta orders have been accepted for Etec's next-generation electron-beam tool,
which will be commercially available in early summer of 1999. Pricing information on the new systems was not available at
press time.

Etec also completed the shipment of its first ALTA 3500 IC mask pattern generation system to the new Photronics facility in
Hillsboro, Ore.'s Technology Park (EN, The Fab Line, Oct. 27).

sumnet.com