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To: Petz who wrote (1774)10/28/1997 5:34:00 PM
From: Time Traveler  Respond to of 6843
 
Petz,

"...going from 4 to five layers, as AMD did with the K6 can allow for such an increase in FET density"

An analogy to this is a PCB (printed circuit board). You can increase the density of the components by adding more layers of traces (of course, there is a limit).

"Isn't the fifth layer just power and ground?"

Not necessarily, you can grow slower signal traces on this layer as well. Inside such a CPU, not all signals are running at the speed limit.

"this rally will not last"

It does not really matter whether this rally is going to continue or not. If it does, great. If it doesn't, I will keep a very keen eye on the market, waiting for the right opportunity to grab a few shares of deeply discounted stocks.

John.



To: Petz who wrote (1774)10/30/1997 3:36:00 AM
From: Yousef  Respond to of 6843
 
John,

Re: "Is it true that the Intel Tillamook notebook 0.25 um chip still uses a four layer
process, but that Deschutes will use five layers?"

My understanding is that both Tillamook and Deschutes use the Intel
.25um process which has 5 layers of metallization.

Make It So,
Yousef