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Technology Stocks : Qualcomm Moderated Thread - please read rules before posting -- Ignore unavailable to you. Want to Upgrade?

To: quartersawyer who wrote (88185)	1/25/2010 3:02:01 PM
From: waitwatchwander	Respond to of 197271

Title: Encapsulation methods for interferometric modulator and MEMS devices Application Number: 20100014146 Assignee: QUALCOMM MEMS Technologies, Inc. Abstract: Methods and devices used for the encapsulation of MEMS devices, such as an interferometric modulator, are disclosed. Encapsulation is provided to MEMS devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer providing protection from environmental hazards, the encapsulation layer is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer. It's good to see this Qualcomm patent, as environmental hazards could of been just as deadly a show stopper as costs. The mentioning of a layer for additional circuit elements is also interesting.