To: Steven Angelil who wrote (7943 ) 11/3/1997 11:29:00 AM From: Paul Dieterich Read Replies (2) | Respond to of 25960
Samsung to use .25 Micron to combine logic and memory in 1998:Intel Aids Samsung's Chip Unit (11/03/97; 10:50 p.m. EST) By Jack Robertson, Electronic Buyers' News Ask Samsung Semiconductor's president what will differentiate his company from the other DRAM makers moving into the embedded-logic arena, and the answer comes quickly: Intel Corp. Samsung's latest tie with the Santa Clara, Calif.-based microprocessor giant - a deal to produce a single-chip graphics controller with embedded DRAM - could create the large volumes critical to making Samsung a viable supplier of systems-on-a-chip, said Yoon-Woo Lee in an interview at his office in Kiheung, South Korea. The single-chip version succeeds Chips & Tech's current chip-set version, Lee said. Samsung already is one of Intel's major SRAM suppliers, and one of just a few that are shipping SRAMs for the cache integrated inside the Pentium II cartridge. The ties between the two extend to Intel's 10% stake in Samsung's new Austin, Texas, fab and a corresponding claim on 10% of the DRAMs produced there. Samsung may further strengthen its bonds with Intel by joining the EUV Limited Partnership, which Intel set up to develop a next-generation extreme- ultraviolet (EUV) lithography system. Motorola Inc. and Advanced Micro Devices Inc. are already partners with Intel in the EUV project. Lee said Samsung is also considering joining a new international subsidiary that Sematech, the U.S. semiconductor consortium, is trying to set up. "After all, with our new fab in Austin, we are neighbors of Sematech and would like to work with them," he said. The South Korean manufacturer is counting on achieving production economies of scale with the embedded-DRAM graphics chip it is making for Intel, in order to get a quick jump on sales to other OEMs. Already, Samsung has built prototypes of a similar chip for Trident Microsystems Inc., Mountain View, Calif., Lee said. Some industry analysts are skeptical that the new embedded-DRAM market will build up quickly, and some question whether South Korean DRAM makers have the expertise to shift rapidly into integrated memory-logic chips. Lee said Samsung modified the design and production of DRAM cells to match logic gates in order to process both on the same chip. The embedded devices also required more-complex, additional layers of metallization on the chip - three layers for the Chips & Tech graphics controller and four layers for the Trident device, he said. Samsung is currently using a 0.35-micron process for its embedded chips, but next year will shift to 0.25-micron wafers. That will enable the company to put 64-Mbit DRAM on the same chip as logic. A major Samsung goal is to diversify into higher-margin value-added semiconductors and to shift away from DRAM. Samsung's production volumes of embedded chips will not approach DRAM output for some time, but Lee said profit margins on the new devices will be considerably higher than on the commodity memory products.