Thread,
The following article may be of general interest to INTC investors:
From Electronic Buyers News:
November 10, 1997, Issue: 1083
Section: Interconnect
What the technology leaders are focusing on
By Ken Fleck
There are numerous connector companies that claim they are engaged in innovative product activity. But there are actually only a few manufacturers that are true technology leaders. The following is a list of such innovators:
- AMP Inc. is working with Intel Corp. on Slot 1 modules. The Harrisburg, Pa.-based connector leader is also involved in
mezzanine-card connectors, AGP 1-mm connectors, and NLX next-generation, low-profile system interconnectors. AMP offers 2-mm-pitch Z-Pac connectors in modular monoblock and stripline designs with up to 10 rows for high I/O. The company also has 5+2 row shielded connectors for Compact PCI and VME 64, and is heavily involved in z-axis research.
AMP has also developed several connector systems for MCMs.
- Berg Electronics Corp., St. Louis, has begun working with Intel on Slot 1 modules. The company has developed the SPCI 0.8-mm-pitch connector, mezzanine-card connectors, and the 2-mm-pitch Metral connector, with four to 10 rows for high I/O. In addition, Berg has designs for high speeds ranging up to 500 MHz, including interstitial connectors, designs that designate certain pins as ground, connectors with shielding, stripline designs, and egg-crate designs. Berg is also involved in z-axis research.
- Erni Components Inc., Chester, Pa., has introduced 2-mm-pitch Hard Metric 5+2 row shielded connectors for Compact PCI and VME 64.
- France's Framatome Connectors International and Burndy Corp., Norwalk, Conn., are working with Intel on Slot 1 modules. FCI has designed 1-mm- and smaller pitch connectors and AGP 1-mm-pitch
connectors. The company also offers 2-mm-pitch Milli-Pac four-row and up for high I/O.
- Germany's Harting Elektroniks markets connectors for VME 64, VME 64X, and VME 320. The company offers 2.5-mm-pitch Har-Pac five-row to eight-row for high I/O. It also offers the Har-Pac mini-coax for speeds up to 2 GHz.
- Japan's Hirose Electric Co. Ltd. has introduced mezzanine-card connectors at 0.8-mm and 0.5-mm pitch.
- IBM Corp. is the technology leader in bare-die attachment by flip chip and is a leader in MCMs. IBM also handles the "dendritic"
process (z-axis) and offers connectors for speeds up to 800 MHz.
- ITT Cannon, based in Santa Ana, Calif., offers 2-mm-pitch Tempus four-row and up for high I/O, and it has introduced serial storage architecture.
- Japan Aviation Electronics Industry Ltd. is offering 0.5-mm-pitch
docking connectors and is in development of 0.3-mm-pitch devices.
- France's Labinal Components and Systems Inc. (Cinch Connector Division) is producing fuzz button (z-axis) for LGAs on pitches of 1.27 mm and 1 mm. The company is developing fuzz-button designs for high-density I/O and automotive electronic modules.
- Molex Inc., Lisle, Ill., is working with Intel on Slot 1 modules. Molex is also focusing on mezzanine-card connectors and AGP 1-mm pitch. It offers 2.5-mm-pitch OmniGrid five-row and up for high I/O.
- Packard-Hughes Interconnect, Irvine, Calif., produces Gold Dot (z-axis) for speeds as high as 2 GHz and pitches as low as 0.1 mm. The company is working with Yamaichi Electronics, San Jose, on substrate interposers and burn-in of known-good die.
- The Panda Project Inc., Boca Raton, Fla., has created the very small peripheral-array package with bare-die attachment by wire bonding.
- Germany's Siemens AG has created a 2.5-mm Sipac five-row connector for high I/O. The company has also introduced Speed-Pac clamshell-design 2-mm pitch for speeds of 500 MHz and above.
- Thomas & Betts Corp., based in Memphis, Tenn., has created the metallized particle interconnect connector with proprietary silicone impregnated with metal particles (z-axis) for high speed. T&B also offers PAI design.
- 3M Co., St. Paul, Minn., is a leader in bare-die attachment with tape-automated bonding. The company is developing connectors with 0.4-mm pitch and is also involved in z-axis research.
- Yamaichi Electronics has teamed up with Packard-Hughes on substrate interposers.
-Ken Fleck of Santa Ana, Calif.-based Fleck Research, a division of Global Connector Research Group Inc., can be reached at www.fleckresearch.com.
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