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To: Richard Tuck who wrote (39820)	11/10/1997 2:26:00 PM
From: Paul Engel	Read Replies (2) \| Respond to of 186894

Richard - Re: "The more I think about this, the more I am convinced that this is just the CMOS7S process. While the CMOS7S process is really 0.12um Leff (0.16um drawn), it does have 6 layers of (copper) metal (plus a local interconnect level) and has been available for a while in our labs. The technology will be available as the SA-27 ASIC process starting next year and will of course be used for standard products such as the PowerPC." Thanks for sharing that information. This process is pretty agressive and should have excellent capability. Are you up to date on whether IBM will use this process for Cyrix's new devices or if they (Cyrix) will abandon IBM ME when they are fully absorbed into National Semi? Paul