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Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: Cary Salsberg who wrote (24614)	10/10/2010 9:40:58 PM
From: etchmeister	Respond to of 25522

The percent fell with 300 mm Actually some equipment makers offered "bridge tools" - a 200 mm tool ready to be converted to 300mm...this article is 10 years old Lam Unveils Its Next-Generation Etching Tool Electronic News, Nov 27, 2000 by Jeff Chappell * 1 * 2 * Next 2300 gets nod from fab firms TSMC, UMC Lam Research Corp.'s next-generation tool has the company ready for the ramp of copper and a larger wafer size or for the technology purchases that come during a downturn, whichever may be ahead in 2001, according to Jim Bagley, the company's chairman and chief executive officer. Lam recently took the wraps off its new line of etchers, the 2300 series, that the Fremont, Calif.- based company says is equally at home etching 200mm or 300mm wafers and aluminum or copper, and is extendable down to 0.10-micron device features. "(Rather than call it a bridge tool), we'd like the tool to be thought of as a next-generation etcher," Bagley said. He observed that the timing of the 2300's development and introduction may prove fortuitous for Lam, given the current uncertainty of the semiconductor market. "Any time you can introduce next-generation products when the industry is slowing, it will always help revenue objectives," Bagley said. "But we're not even clear, in spite of all the discussion, if there is a slowdown or a downturn or exactly what's going on. For the near term, the outlook for us is very strong, but in this business anything can change rapidly. "The industry can change quite dramatically, but having a whole series of new products that will support a wafer-size transition as well as qualifying work on 130-nanometer and high- and low-k (dielectrics), is a real help," he said.