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To: ForYourEyesOnly who wrote (8961)	11/11/1997 1:16:00 AM
From: Yousef	Read Replies (1) \| Respond to of 25960

THC, Re: "Many manufacturers have found the switch to DUV to be difficult ..." We have done a source inspection which includes printing wafers for resolution and overlay (checks both alignment and distortion). Our machine easily met specifications ... this is classic Nikon, they set very conservative specs that they meet 99.5% of the time. BTW, I am more concerned with selecting a DUV resist and determining whether to use a BARC (Bottom Anti Relecting Layer) on a number of different surfaces (poly, TiN, Si3N4, SiO2 ...). Each of these surfaces will have to be optimized with the litho and etch processes. I'm expecting the DUV exposure tool to operate very smoothly. Yousef