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To: eracer who wrote (8)12/29/2010 9:59:07 PM
From: neolibRespond to of 73853
 
Seems like a logical step, ARM has been using the POP approach in smartphones now for quite awhile. IIRC, IBM was quite aggressive with MCM substrates at one point in mainframes, and IIRC, not only CPU interconnects but either large amounts of SRAM or even DRAM was included.



To: eracer who wrote (8)12/31/2010 12:51:05 AM
From: etchmeisterRead Replies (1) | Respond to of 73853
 
Intel is flexing their chip packaging muscles, and the payoff is going to shock people.

T(hrough)S(ilicon) V(ia) - LRCX, AMAT, NVLS - it's done deal


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