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To: Ginko who wrote (9433)	11/13/1997 3:00:00 PM
From: Paul Dieterich	Respond to of 25960

Korea's Dongbu to use SVG litho tool A service of Semiconductor Business News, CMP Media Inc. Story posted at noon EST/9 a.m. PST, 11/13/97 SEOUL -- The Dongbu Group, the latest South Korean chaebol planning to build a new DRAM fab, has placed a multiple order for Micrascan-III step-and-scan production tools from SVG Lithography of Wilton, Conn., according to industry sources. Dongbu is the chip maker that SVGL declined to identify in its Oct. 30 announcement of a $40 million order from a South Korean semiconductor manufacturer, according to the sources. SVGL officials in the United States declined to comment on the report. The SVGL Micrascan-III system is a natural choice for Dongbu, which reportedly is paying IBM Corp. up to $250 million for technology and assistance in helping the chaebol enter the 64- and 256-Mbit DRAM market. As part of the agreement, Dongbu will sell all of its DRAM output to IBM during the first year of production, which is expected to being in 1999 (see Nov. 6 story). IBM Microelectronics uses SVGL lithography tools to make critical layers for its own DRAM production. A Micrascan system was also used to develop the 256-Mbit DRAM in the alliance of IBM, Toshiba Corp. and Siemens AG. SVGL said the three other Korean chip makers -- Samsung, Hyundai and LG Semicon -- have installed its Micrascan systems in their development fabs. So far the three firms haven't followed up with any production orders. Samsung split its lithography order between Nikon Corp. and ASM Lithography for its latest fab in Austin, Tex. Samsung has also put $10 million up-front payment in the special project at Massachusetts Institute of Technology to develop a 193-nanometer excimer laser deep UV tool using the SVGL step-and-scan platform, as previously reported by Semiconductor Business News. Three other U.S. chip makers and a second unidentified Korean firm also partners in the 193-nm project.