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To: ed who wrote (8998)11/15/1997 1:31:00 PM
From: ed  Respond to of 97611
 
And what is more, TSMC and UMC will move forward to 0.25 um CMOS process
pretty soon, and the cost of components will be further down , and speed of device will be further up , and power dissipation further down !!!!Also I heard that INTEL had some agreement with TSMC to transfer the production of some of its product lines to TSMC so that
Intel can have more wafer fab capacity available in the United States
to manufacture those high value added CPUs for 1998, 1999. The negotiation of Intel with Samsung for wafer fab capacity is currently
under going !!!!!!!!!!!!!All those point to high growth of PCs delivery in 1998, 1999 all the way to 2000s !!!!!!!!!!!!!



To: ed who wrote (8998)11/15/1997 3:42:00 PM
From: hpeace  Read Replies (1) | Respond to of 97611
 
ed, yep..it's that productivity issue that you and I agree on..
the name of the game is increase the quality of the processes while drastically redcuing cost and cycle times