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Technology Stocks : Cymer (CYMI) -- Ignore unavailable to you. Want to Upgrade?

To: Zeev Hed who wrote (9837)	11/17/1997 9:15:00 AM
From: Maxwell	Respond to of 25960

Zeev: <<However, I would have assumed that in order to etch the trenches, you would use a mask anyhow which sooner or later will have to be removed, thus dipping first in the sensitizing agent (with the trench making mask still on) and then in the electroless bath (still with the mask on) will actually save the relatively lengthy process of CVD'ing 500 angstroms without adding steps, since the mask removal step is still necessary after the etching of the trenches.>> You are right about etching the oxide. This is where CYMI comes in to print those .25um narrow lines and trenches. The resist is then strippped after etch. The 500 angstrom Cu CVD is then deposited. You need this layer prior to electroplating. Its function serve 2 purposes. One is to form a conductive surface. Second is that it is a "seed layer" or "nucleation layer" for Cu atoms to aggregrate. Without this layer electroplating doesn't work. Cu atoms have to way to build monolayer on monolayer. Cu atoms like to stick to itself rather than other metallic surface. Also you need to strip the resist. Dipping into a chemical Cu solvent may dissolve the resist and cause potential contaminants and defects. Maxwell