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Microcap & Penny Stocks : AIRP -- Ignore unavailable to you. Want to Upgrade?

To: Joan Osland Graffius who wrote (326)	11/21/1997 10:48:00 AM
From: Rich Kaiser	Respond to of 487

Hi Joan, I'm awaiting a complete transcript from the interview. But, from what I understand from the few shareholders in the Southern CA viewing area, The interview went very well. Mr. McMinn's presentation on our company was very impressive. He outlined the FACTS, which everyone on this thread are very versed on corporate status. As soon as, I get the transcript I will post. Thanks for your continued support. Rich AIRP

To: Joan Osland Graffius who wrote (326)	11/24/1997 10:51:00 AM
From: Rich Kaiser	Respond to of 487

BUSINESS WEEK MAGAZINE/DEC 1, 1997 Edition: Written By: Catherine Arnst "Developments to Watch" Semicondutor wafers are becoming ever more delicate and valuable prompting the development of a new packaging technology that suspends wafers in a pressurized air bubble. The SDS AIR BOX, an alternative to foam and/or bubble wrap was developed by AIR PACKAGING TECHNOLOGIES, INC. of Valencia, CA. with help from MOTOROLA, Inc. AIR PACKAGING TECHNOLOGIES' President, Garivn McMinn, says air wrapping was conceived in the Mid-1980's as a novelty for gifts, but it took years of research to develop the AIR BOX's eight layered bag. The bubble, which looks like a thick zip-lock bag can hold its strength during air pressure changes and insulate against static electricity that can destroy delecate electronics....