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To: Starlight who wrote (10124)	11/20/1997 8:18:00 PM
From: James Word	Respond to of 25960

Elizabeth: RE "I've been told that the mask distortion at 1X isn't as great a problem as it seems as XRL has much greater process latitude. XRL doesn't have the cleanliness requirements or depth of focus requirements" That much is true. Depth of focus on X-ray tools is essentially infinite. So variations in the Z (up/down) direction aren't as important. However, any distortion on the mask membrane in the XY plane will result overlay (alignment of mask to wafer) problems. I seem to recall that one possibly important parameter with X-ray tools is the gap between wafer and reticle. It may need very tight control. If so, then those distortion in the Z direction could be a problem. I still think that X-ray masks are no more challenging to make than an Alternating Phase Shift Mask with OPC. That may be their saving grace. Sort of a lesser of two evils thing. James Word