To: Ronald Paul who wrote (2440 ) 11/20/1997 8:01:00 PM From: David R. Lehenky Read Replies (1) | Respond to of 10309
Here are some highlights from today's conference call, as I heard them. I have left out the summary of the revenue numbers, etc., since Allen mentioned many of them in his recent post. I could have certainly left out something that someone else might have considered significant. o now 18,000 Tornado users (DL: I think this is double the number of seats a year ago); o head count is now 410 vs 308 at the end of last year; o 15 new I2O products were introduced by various companies at Interop; 25 new I2O products were introduced at Fall Comdex; o I2O will provide about $2M this year, mostly from tools; o Q1 of next year should mark the beginning of I2O run-time $$; o Intel estimates 10M units in first 24 months - the clock starts now; o the first 2 buildings will provide 150,000 sq. ft. of space and will be available Q3 of next year - this is double their current leased space; o the new space will add about $1M/year in expenses, offset by new revenues, of course; o will grow through $100M next year, no problem; o will not be affected by current problems in Asia, since it is currently a very small part of overall revenue, although it is growing very fast; o $1-2M next year from DSP; o DSP market is where embedded processor market was 10 years ago; o 17 CPUs supported now, with 6-7 new ones in progress; o no price pressure from ISI pRISM+, and head-to-head design wins remain significantly in WINDs favor; o WinCE is not an issue because: 1) it is not "hard" real-time - it has "latency in the milliseconds", 2) needs 2-3Mbytes of RAM, 3) WIND provides top-quality field service to support the product, and 4) WINDs royalty structure is MUCH lower; o they are getting very good feedback from customers on the quality of WINDs support; o WIND feels that providing the engineering expertise that a customer needs (professional services) is an integral part of their "time-to-market" product focus; and o HP JetSend is a big deal - it will encompass both low-end and high-end devices (DL: this is HP writing the standards for EID communications). That's all I have. Hope this helps! -Dave Lehenky