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To: shane forbes who wrote (7977)11/26/1997 9:20:00 AM
From: Moonray  Read Replies (2) | Respond to of 25814
 
LSI Logic Introduces Mini-Ball-Grid Array and Chip-Scale Packages

Cost Reduction and Miniaturization Goals Easily Met with New Range
of Small Inexpensive ASIC and Standard Product Packages

MILPITAS, Calif., Nov. 26 /PRNewswire/ -- LSI Logic announced today
the addition of a miniature Chip-Scale package (CSP) family of chip
packages today, capable of supporting very dense 0.8- and eventually
0.5-mm ball pitches or spacing between solder balls. Combined with
these CSP entries, a Mini-Ball-Grid-Array (mini-BGA) offers a very
inexpensive package choice for 1.0-mm ball pitch applications. These
are the latest additions to LSI Logic's extensive line of packages
tailored to the broadest range of applications.

biz.yahoo.com

o~~~ O



To: shane forbes who wrote (7977)11/26/1997 11:58:00 PM
From: Duane L. Olson  Read Replies (1) | Respond to of 25814
 
OWO.. CNN Moneyline: Toshiba exiting the PC market; can't compete with prices under $1,000. U.S. has the low cost producers?.. thoughts? TSO
Ole!


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