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Technology Stocks : Kulicke and Soffa -- Ignore unavailable to you. Want to Upgrade?

To: HoodBuilder who wrote (2214)	11/30/1997 11:15:00 AM
From: Darin	Respond to of 5482

Thread, I found three "recent" articles on the K&S Homepage (http://www.kns.com) which I don't believe were ever posted here, or every made formal press release: New K&S 8090 Large Area Wedge Bonder Features Integrated Surface Mount Capability Willow Grove, PA, November 11, 1997 - Kulicke & Soffa previewed the new Model 8090 Large Area Wedge Bonder at the Productronica '97 Expo in Munich. The 8090 will position K&S with a competitive offering that addresses productivity, fine pitch, reliability and flexibility. The 8090 features the industry's largest bondable area and the ability to integrate material handling systems (MHS) with other surface mount equipment. This ideally suits the machine to efficiently process the large panels and multi-up carriers used in the assembly of chip-on-board (COB), chip-on-flex and multi-chip module (MCM) devices. The 8090 also offers the industry's highest throughput - more than 5 wires per second - as well as better than 70 micron pad pitch capability and world-class reliability. In addition to gold wire, aluminum wire can be used to meet or exceed a wide range of process requirements, including those posed by ultra-fine pitch, high-wire-count multiple-die MCMs and temperature-sensitive substrates. Exceptional machine performance and capability results from the 8090's large, open access area in which a high-speed, high-precision bondhead table is mounted above the material handling stage. This unique architecture allows a variety of MHS options, providing application solutions for up to 152 x 305 mm boats or 356 x 406 mm printed circuit boards. "The 8090 is the newest member of our revolutionary 8000 wire bonder platform," said Asuri Raghavan, a K&S senior vice president and president of its Equipment Group. "It provides twice the accuracy and throughput of our previous large area bonder and readily integrates with other surface-mount equipment to provide maximum utilization. In addition to rounding out our wire bonding product line, the 8090 positions K&S to become a leader in the large area wedge bonding market."

To: HoodBuilder who wrote (2214)	11/30/1997 11:16:00 AM
From: Darin	Respond to of 5482

The next one, Kulicke & Soffa and Tessera Announce Program To Develop Next-Generation 8070 æTAB and æBGAr Bonder Willow Grove, PA, October 23, 1997-Kulicke & Soffa Industries, Inc. and Tessera Inc. have announced a program to develop next-generation rotary head lead bonding equipment for the production of æBGAr (Micro BGATM) packages for integrated circuits. Under the program, K&S will develop and market the lead bonder, which will include a high-speed rotary bondhead specifically designed for radial and orthogonal leads, a leadframe workholder, and special bonding tools from K&S' Micro-Swiss subsidiary. "There is a significant equipment demand for the manufacture of æBGA products for memory applications," said K&S Director Bob Wise. "We are pleased that Tessera has selected K&S to develop the radial lead æBGA bonding capability these products will require. Our solution will be based on the industry leading K&S 8000 wire bonder platform to ensure the highest possible throughput, yield and reliability." "Kulicke & Soffa's development of the Model 8070 single-point bonder for the æBGA package will provide Tessera's growing licensee base with a very cost-effective and flexible bonding system," said Dr. Tom Di Stefano, Tessera's vice president of marketing and chief technical officer. "Our R&D staff is ready to provide engineering support and technology transfer to Tessera licensees who upgrade to the new K&S bonder. "This bonding system will incorporate significant technology advances for its users, such as the ability to adjust the bond motion automatically to compensate for minor die placement variances during æBGA assembly," Di Stefano added.

To: HoodBuilder who wrote (2214)	11/30/1997 11:16:00 AM
From: Darin	Respond to of 5482

And the last, K&S 1474vfp Wedge Bonder Earns Editors' Choice Award Willow Grove, PA, October 13, 1997 - Kulicke & Soffa Industries announced today that its Model 1474vfp Gold and Aluminum Wedge Bonder received a 1997 Editors' Choice Best Product award from Semiconductor International, the leading magazine serving the semiconductor industry. Each year, the magazine identifies and recognizes the products that are most significantly advancing the state-of-the-art of semiconductor manufacturing and related operations. Products are nominated by equipment users, then evaluated by the magazine's editorial staff and an impartial panel of judges. The editors of Semiconductor International magazine presented a commemorative award plaque to K&S at SEMICON/Southwest, a major trade show in Austin, Texas. "K&S developed the Model 1474vfp wedge bonder in response to the industry's need for a highly reliable, fine pitch machine that will support future die shrinks and provide reduced cost of ownership," said Dave DeGrappo, K&S product manager, wedge bonder business. "Its selection for an Editors' Choice award demonstrates our leadership position in wire bonding and shows how K&S supports customers with best-in-class manufacturing solutions."