To: IMW who wrote (2227 ) 12/2/1997 9:48:00 AM From: Maya Respond to of 5482
Tuesday December 2, 9:01 am Eastern Time Company Press Release Hyundai Electronics Industries Orders 86 Additional K&S Gold Ball Bonders WILLOW GROVE, Pa.--(BUSINESS WIRE)--Dec. 2, 1997--The Semiconductor Assembly & Test Division of Hyundai Electronics Industries Co., Ltd., a major assembly subcontractor, has ordered 86 additional Kulicke & Soffa (NASDAQ: KLIC - news) Model 1488 plus gold ball bonders for its production facility in Ichon City, Korea. The automatic wire bonders will be used in the manufacture of plastic ball grid array (PBGA) and Micro BGA(TM) semiconductor devices for the computer industry. Kulicke & Soffa's automatic wire bonding equipment offers the best performance, which results in the highest yield during the assembly of these packages. ''Hyundai Electronics' decision to purchase 86 K&S 1488 plus bonders for demanding BGA applications, in addition to 436 machines purchased earlier this year, is a testimonial to our continuing leadership in the fastest growing segment of the wire bonding market,'' said Michael Wolf, K&S vice president of sales. ''We have developed special software and vision systems which meet the unique looping challenges encountered during the assembly of BGA devices, resulting in exceptionally high productivity and yield,'' he added. Kulicke & Soffa is the world's largest supplier of semiconductor assembly equipment. The company serves the integrated circuit assembly market with a product line that includes wire bonding, die bonding, wafer dicing and factory automation equipment, as well as packaging materials, including bonding wire, capillaries, wedges, die collets and saw blades, and has sales and service facilities worldwide. The company's web site address is www.kns.com . Micro BGA is a trademark of Tessera Inc. Contact: Kulicke & Soffa Media: Henri Van Parys, 215/784-6818 Analysts: Jim Chiafery, 215/784-6436