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Technology Stocks : COMS & the Ghost of USRX w/ other STUFF -- Ignore unavailable to you. Want to Upgrade?

To: Moonray who wrote (10161)	12/4/1997 12:43:00 PM
From: David Lawrence	Respond to of 22053

HOUSTON, Dec. 4 /PRNewswire/ -- Marking a major milestone in the relationship between industry leaders Texas Instruments Incorporated (NYSE:TXN) and 3Com Corporation (NASDAQ:COMS), TI announced today that it has shipped its 35 millionth DSP solution to the modem maker. Much of the volume is attributed to the growth of Internet use and to demand for faster, feature-rich modems. "TI's DSP chipset has been a catalyst for 3Com's retail leadership and our growth to a number one position in voiceband modems. TI's DSP chipset platform provided the re-programmable base that allowed us to drive a new paradigm of user-upgradable modem software, as with the 56Kbps x2(TM) technology," said Jerry Devlin, vice president and general manager of 3Com's Personal Communications Division. "In this ever-changing market space, our strategic relationship with Texas Instruments continues to grow, maintaining its importance to our competitive advantage." 3Com, formerly U.S. Robotics, has repeatedly been first to market with the most advanced, fastest retail modems, due in large part to the programmability of TI's DSP chipset. Because of the unique programmability of the DSP solution, 3Com modems can be easily upgraded to faster implementations and new enhancements via a simple software download from the Internet. "3Com continues to demonstrate innovation in modem technology as they did when they began developing with TI DSPs several years ago. This has paid off in market share," said Phil Campbell, DSP datacom manager for TI. "Texas Instruments is the leader in DSP solutions and 3Com is a leader in retail and OEM modems. For many years it's been an ideal combination for providing customers with the best modems on the market." "We continue to work with 3Com to bring leading modem products to market using our customizable DSP (cDSP(TM)) technology," continued Campbell. TI's cDSP capability combines a broad-based roadmap of leadership DSP architectures, mixed-signal/analog products, peripherals and memory, resulting in high levels of integration and an optimal balance of cost, size, power and performance. This allows customers to determine the right level of integration and flexibility to address their specific market requirements.