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Technology Stocks : General Lithography -- Ignore unavailable to you. Want to Upgrade?

To: Andrew Vance who wrote (708)	12/5/1997 12:26:00 PM
From: Nick Michell	Read Replies (1) \| Respond to of 1305

I wondered if any of the process experts out there might know how far this is away from being in production. I would guess several years, but it's not really my field. ti.com DALLAS (Reuters) - Texas Instruments said its researchers have demonstrated a chip manufacturng process in which it combines copper wiring with an insulating material, called xerogel, in an integrated ccircuit The xerogel material "has the lowest dielectric constant known other than air," and is "a material made of microscopic glass bubbles containing air which is nature's ideal insulator" How does this stuff compare to other low-k dielectrics? Are there any semi-equipment companies that would especially benefit from a switch to this material? Thanks, Nick