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To: StockMan who wrote (41746)12/8/1997 5:46:00 PM
From: Petz  Read Replies (4) | Respond to of 186894
 
sTOCKMAN, re:<Especially your made up numbers for yield, and fixed area per chip>

The 81mm die size for the K6-3D is a published number, I didn't make it up. With only 9mm x 9mm dimensions, there's little wasted space around the edges of the wafer.

Any decent semi fab (IBM, MOT, NSM, AMD, even TSMC) should be able to get their 0.25 process at 60% yield within a year.

Petz