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To: Paul Engel who wrote (41786)12/9/1997 1:32:00 AM
From: kash johal  Respond to of 186894
 
Thanks very much for the clarification.

IMHO these die yields are extremely impressive it does indeed show remarkable process control and ultra-low defect density.

I also caught your note about Intel bringing on some field programmability and embedding flash on chip.

For extremely complex die they could use this to build in redundancy and increase yields (perhaps they are already doing it?

Still very impressive yields and technology.

Thanks again.

Kash.