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To: Petz who wrote (2825)12/10/1997 12:30:00 AM
From: FJB  Respond to of 6843
 
Petz,

RE:Can any AMD insiders reveal if AMD intends to do the C4 bump processing themselves instead of sending to IBM

Two CCs ago Sanders said AMD would try doing C4 packaging themselves. I don't know the status of their effort.

Bob



To: Petz who wrote (2825)12/10/1997 12:40:00 AM
From: Elmer  Respond to of 6843
 
<Also, can any AMD insiders reveal if AMD intends to do the C4 bump processing themselves instead of sending to IBM.>

Petz, Please don't ask people to identify themselves as insiders. Many people from many sources would like to remain anonomous. That's one of the great aspects of SI. Please respect their positions.

EP



To: Petz who wrote (2825)12/10/1997 2:42:00 AM
From: Paul Engel  Respond to of 6843
 
Petz - Re: " Is this true for both the Tillamook and the upcoming Deschutes?"

Yep.

I've even seen video tapes of the flip chip bonding operation.

Real cool!

Paul