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To: Tulvio Durand who wrote (11336)12/10/1997 6:24:00 PM
From: Yakov Lurye  Read Replies (1) | Respond to of 25960
 
Tulvio,

Technical specialists on this thread may be able to shed more light on the question.

In short, I do not know an answer to your questions and I do not want to mislead you. My gut feeling is that for relatively simple DRAM designs, mixed production line (i-line and laser) will not be an optimal solution. Either pure i-line or pure DUV production line will be more economical.

Again, I know very little about lithography and may be way off. The only reason for venturing a guess is that I'd done a few production line optimization studies before....

1. both 64M and 256M DRAMs could be produced using either .35nm or .25nm line-width equipment; I have no data on tradeoffs in terms of yield per 8" wafer.

2. "mix and match" should not affect the throughput if measured in wafers per hour: production line of two sequential machines with 80 wafers/hr throughput theoretically yields 80 wafers/hr, not 40wafers/hr (of course, if you take into account downtimes, the throughput will be lower).

However, it may affect yield per wafer (pure .25nm could yield a smaller chip).

3. Prices for steppers with laser and i-line light source may be close, considering that laser reportedly accounts for less than 10% of the stepper cost; on the other hand, maintenance expenses may differ significantly (AMD article said 250k vs. 25k per stepper)

4. besides the equipment cost/maintenance data, there are many other parameters that determine the optimal production line design, including duration of the production run, possible reuse of equipment, etc.

Regards,

Y.