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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Petz who wrote (26846)	12/17/1997 11:25:00 PM
From: Time Traveler	Respond to of 1574267

Petz, I am still not too sure that 0.25um MMX is 95 mm^2 in die size. Since Intel 0.25um process also utilizes 5 layers of metal vs. 4 layers on 0.35um, it is not a simple die shrunk. Local interconnects is itself another layer, so it is conceivable that K6 with LI on 0.25um has smaller die size than MMX without LI on 0.25um. Another thing to consider is that Intel locates C4 bumps along the perimeter of the chip while AMD chooses to scatter them randomly anywhere on the chip. Contact points around the perimeter would result a bigger die size (yes) but easier to align to the connects on the substrate and to test as well, thus better yield. You see! There are a lot of trade-offs in engineering! Don't be so narrow minded on one thing --- the die size --- just like that dear old-timer Brian. John.