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To: Stitch who wrote (11099)	12/20/1997 7:55:00 PM
From: Mark Adams	Read Replies (1) \| Respond to of 12298

IBM themselves mentioned that GMR head mfg requires the same equip as MR- the GMR head actually uses a TFI element to write and the GMR element to read. The link Don posted, and two excerpts are Almost all of the equipment required for TFI wafer fabrication is utilized for MR wafer fabrication as well. Fabrication of MR wafers also require additional precision sputtering equipment to form the thin layers of the MR element and lead structure. Facility requirements are similar, although as new wafer fabs are completed much more stringent environmental controls are implemented. <snip> Slider fabrication of TFI and MR products is nearly identical. All of the processes required to produce a TFI slider are required to produce an MR slider, with the exception of the pole shaping process (no undershoots are present in the MR readback signal). MR sliders do require the addition of a sputtered diamond-like-carbon film (DLC) on the ABS surface to reduce ESD sensitivity and improve both corrosion resistance and frictional properties. idema.org (Thanks Don) I knew this, but it was nice to see it confirmed by a second source