Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: steve h who wrote (27038)	12/21/1997 3:11:00 PM
From: Investor A	Read Replies (1) \| Respond to of 1574165

Steve, Check this one: isjm.com

To: steve h who wrote (27038)	12/22/1997 8:45:00 AM
From: Maxwell	Read Replies (1) \| Respond to of 1574165

How to Cool Down Your CPU the Right Way: Most CPU cooling gadgets out there use a single stage of aluminum cooling fin coupled with a fan blowing in the direction away from the chip. If you touch this cooling fin with your finger and feels that is hot then you know the chip is even hotter. Most of the data I've seen showed that the temperature of the top side of the ceramic can be anywhere fron 43-50+C with this typr of cooling. If you overclock the chip this temperature can go up considerably and if the chip gets too hot then your system may crashes. Here are ways wich I plan to use to cool down my chip. 1) If you apply a thermal paste (like toothpaste) between your chip and the heat sink then you get much better thermal contact to the heat sink. Why? ---a) If you don't then the heat sink and the chip only touches at a few points when they are pressed together, even though the heat sink is perfectly flat. These few connected points are places where most of the heat conduction occurs. ---b) A paste is usually a nonconductive fluid that is mixed with a fine silver power. Thus the paste is like a colloid with silver suspended particles. The paste would made contact over the entire area of the chip and thus increase the number of conduction paths through the micro channels of silver particles. Thus conduction improves by orders of magnitude. The paste is messy to use but it helps alot to conduct the heat away from the chip. --c) If you reverse the fan so it blow into the chip then it would cool the chip better. You get more cool air current to the hot part. 2) The best thermal conductors near room temperature are listed as followed with the top being the best ----Silver ----Copper ----Gold ----Aluminum Thus if you use a copper block it is much better than aluminum. Silver is too costly. 3) For all practical purpose, the only way to remove the heat from the chip is from the top surface. You can't get to the bottom of the chip where all the pins are. If you can make a tall block of copper of base area at least equal to the chip (about 2 inches x 2 inches)then the heat will dissipate to the block. I would clamp one end of this block to the case. Then I have one conductive heat path to my case. In between I would put copper (or aluminum) fins all around the copper block. I would then use a big fan to blow at my copper block from one end of the case out to the other. It is very important to get the temerature inside the case down to improve the heat transfer. I might improve it furthers by making a T to the copper block. That end would stick outside the box. Once outside, I can either water cool or use a Peltier device to draw heat out of that end. It will be a Dream Mean Maxwell Machine. I will update you guys with the results once it is up and running. Maxwell