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To: Vattila who wrote (16106)	6/2/2016 9:58:53 AM
From: fastpathguru	Read Replies (2) \| Respond to of 72369

On the other hand, the links on an interposer will incur penalties relative to a monolithic die, so it is a trade-off as well. And interposer technology is still in its infancy, adding counter-acting difficulty and cost. However, if these can be overcome, it seems the right way to go for SOC and large-transistor-count devices, such as GPUs. I think die stacking/interposer tech can be a huge cost saver... It's the next generation of integration. 90% of the motherboard disapears if you integrate cpu, gpu, memory, and IO into a single socket! The limits of interconnect are essentially gone compared to motherboard traces... Printing out interposers with many 1k-wide links ought to be cake, and stacking heterogenous dice likewise ought to be cake once the technology matures. The socket is going to become nothing more than a port that connects power and peripherals to the "system"; Performance goes way up; Footprint and power is reduced; Cooling is centralized; Assembly is simplified; What the interposer represents is no less than the absorption/elimination of a large portion of the PC food-chain. fpg