To: Maverick who wrote (41 ) 1/2/1998 3:58:00 PM From: Scrapps Respond to of 322
Moyco Sells CMP Slurry Assets for Semiconductor Industry to EKC/ChemFirst MONTGOMERYVILLE, Pa., Jan. 2 /PRNewswire/ -- Moyco Technologies, Inc. (Nasdaq: MOYC - news), a Montgomeryville, PA, manufacturer of precision abrasives, semiconductor polishing materials and professional dental supplies, has sold its chemical mechanical planarization (CMP) slurry assets and CMP business product line for the semiconductor industry to EKC Technology, Inc., a wholly owned subsidiary of ChemFirst Corporation (OTC BB:CHMFV - news; NYSE: CEM - news), a manufacturer of specialty chemicals. Moyco has sold assets for its CMP slurry business including propriety formulas sold under the Ultraplane tradename which exclusively incorporate Nanotek(R) particles manufactured by Nanophase Technologies (Nasdaq: NANX - news) via a patented physical vapor synthesis process. The purchase price consideration for Moyco's CMP assets consists of a lump sum payment at closing, a deferred payment and royalty fees based on product sales through 2004. Brown Brothers Harriman & Co. (BBH&Co.) has acted as Moyco's financial advisor on this transaction. BBH&Co. has determined, based on industry and company forecasts, that the net present value of this consideration could exceed $10 million. This determination relies on economic, market, industry, legal and business considerations and/or data currently known to Moyco and BBH&Co. Marvin E. Sternberg, President and CEO of Moyco, stated, ''We are extremely pleased to have completed this transaction with EKC/ChemFirst. We believe that EKC has the resources, technical know-how and marketing expertise to take our superior CMP slurry technology to the next level.'' He added, ''Moyco looks forward to working closely with EKC during the transition period and for our long term mutual financial benefit. Moyco believes that EKC will be successful in capturing a significant portion of market share for this product line.'' Ultraplane polishing slurries exclusively utilizing Nanophase nanometer sized aluminum dioxide and cerium oxide, with nearly spherical particle shapes and uniformly small particle sizes, provide semiconductor polishing results in (i) significantly smoother surfaces, (ii) a faster rate of material removal, (iii) more selective removal of material, and (iv) easier cleaning during the manufacturing process compared to slurries utilizing conventional materials. Moyco and ChemFirst believe that these attributes will be an important element in the production of semiconductor wafers with smaller geometries that will result in increased memory capacity, faster processing speeds and lower production costs. Chemfirst has an extensive history of producing chemicals and chemical related products for a variety of industries. Through its EKC subsidiary, ChemFirst has developed particular expertise in the field of photoresist strippers and post-CMP formulations. ChemFirst's production expertise, research and development capabilities and commercial relationships all position ChemFirst to maximize the value of the Moyco technology and products in the marketplace. In addition, ChemFirst has the financial resources to invest in personnel, laboratory capacity and production equipment. Moyco plans to continue to manufacture precision slurries and coated abrasives for various other applications with significant sales potential in several industries. SOURCE: Moyco Technologies, Inc.