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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Time Traveler who wrote (27757)	1/8/1998 3:46:00 PM
From: Ali Chen	Read Replies (1) \| Respond to of 1572965

Wang: <P-II mounted horizontally rather than taking advantage of radiating heat on both surfaces> <Tell me about intelligence.> OK. your assessment is totally wrong. First, when you say "radiating heat on both surfaces" you probably mean "free convection is doing better with vertical surface orientation". This is generally correct but totally irrelevant here. The reason is that the brick is cooled by FORCED air flow, by means of a fan and a heat sink with LARGE SURFACE. 1) The forced air flow has MUCH HIGHER VELOCITY than the free convection you so worry about. 2) The active heat trahsfer surface of the heat sink is also much bigger than these side flat surfaces of the brick. 3) the plastic cover around the P-II brick is not a good heat conductor, and has no tight contact with the heat source - silicon substrate. Therefore, the factor of free convection is next to negligible in this "problem", and orientation does not matter. Even worse, when the brick is mounted vertically, the free convective airflow and the forced airflow are acting in OPPOSITE DIRECTION along the lower part of the heat sink, REDUCING the local heat exchange. If you really mean the "radiative" heat transfer, the radiation is also independent on orientation. When you say that "horizontal mounting is a more stable mechanically," you are also wrong. The most frequent mechanical "load" for the computer is a drop down during installation or unpacked transportation. With horizontal mounting, there is more chance for the brick to break the motherboard or Slot-1 connector. For your info, there were some Intel design documents talking about "center of inertia" and "force momentum" when an acceleration is applied to a P-II computer. As a former aerospace "engineer", you must understand what I am talking about. In conclusion, the P-II brick is an ugly brick, no matter how to approach it. Finally, don't you see that you are totally unqualfied to discuss these technical matters? Your attempt to rase FUD about COMPAQ engineering has failed miserably. Please restrain yourself to stock TA.