Alliance Semiconductor Introduces Embedded Memory Graphics Chip for Sub-$1,000 PC
Thursday January 8, 6:13 pm Eastern Time
Company Press Release
SAN JOSE, Calif.--(BUSINESS WIRE)--Jan. 8, 1998--Alliance Semiconductor Corporation (NASDAQ:ALSC - news) today unveiled the industry's first embedded-DRAM graphics 2D/3D chip targeted at the sub-$1000 PC market.
The Alliance ED3D, a 2D/3D graphics controller with 2 megabytes of embedded memory, is the first in a family of Alliance embedded memory products. The ED3D was demonstrated running Microsoft(R) Windows(TM) 95 and Direct3D(TM) applications at the recent Comdex show.
''The ED3D is the first step in executing our embedded technology roadmap,'' stated N.D. Reddy, Chairman, President and CEO of Alliance. ''We intend to leverage our memory design expertise to enter new market segments.
''This represents another major step in our diversification plan. Unlike other players in the market, we own both the memory and logic intellectual property, have access to leading edge process technology, and have the required manufacturing prowess to execute an embedded-memory product strategy.''
The ED3D is a fully functional 2D and 3D graphics accelerator for the PC markets. The chip's bi-endian support also makes it ideal for non-x86 platforms. The ED3D incorporates 128-bit 2D and 3D engines, and the 3D engine includes full hardware triangle setup to free the CPU of the cycle-intensive operations of 3D
setup.
The 3D engine also supports such advanced features as MIP mapping, Gouraud shading, alpha-blending, colored fog, lighting, z-buffer, and perspective correction.
''Embedded DRAM enables high performance architectures that are not possible with external memory. Our design methodology of integrating memory and logic intelligently on a single chip will enable us to provide a true 'system-on-a-chip' for emerging markets,'' said Bharat Sastri, VP of Systems Engineering.
The ED3D will be available for PCI interface in a 208-pin PQFP package and is pin compatible and software compatible with the Alliance AT24 and AT3D graphics chips. The footprint and functionality of the ED3D, combined with Alliance's manufacturing capability, makes the ED3D the perfect solution for the emerging sub-$1000 PC market as well as for set-top boxes, net PCs and Java(R) applications.
Alliance Semiconductor Corporation is a leading worldwide supplier of high performance memory and memory intensive logic products. Alliance's product lines include Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), Flash memory, multimedia graphics accelerators and embedded technologies.
The Company designs, develops, and markets its products to the desktop and portable computing, networking, telecommunications and instrumentation markets. Alliance manufactures many of its products using advanced 0.3 and 0.4 micron CMOS technology through a combination of joint venture and independent manufacturing facilities, with many of its leading edge products being developed using advanced 0.25 micron CMOS technology.
Alliance was founded in 1985 with headquarters in San Jose. Additional Company information can be found on our home page: alsc.com .
Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995: Except for historical information contained herein, statements in this press release, including statements about the Company's product diversification strategy and manufacturing capability, are forward-looking statements that are subject to risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements.
Such risks and uncertainties include those relating to the Company's ability to timely develop products, market acceptance of such products, the impact of competitive products and pricing, the Company's ability to manufacture such products in a cost-effective manner, potential disruptions in supply from the Company's
suppliers and other risks detailed from time to time in the Company's reports and filings with the Securities and Exchange Commission (''SEC'').
For a discussion of such risks, see Item 1: Business and Item 7: Management's Discussion and Analysis of Financial Condition and Results of Operations in the Company's Form 10-K for the fiscal year ended March 29, 1997 and Item 2: Management's Discussion and Analysis of Financial Condition and Results of Operations in the Company's Form 10-Q for the fiscal quarter ended September 27, 1997, each of which reports have been filed with the SEC and each of which are available through the Company's home page, alsc.com .
The Company expressly disclaims any obligation or undertaking to release publicly any updates or revisions to any forward-looking statements contained herein to reflect any change in the Company's expectations with regard thereto or to reflect any change in events, conditions or circumstances on which any such forward-looking statement is based, in whole or in part.
Note to Editors: The Alliance logo and ProMotion are registered trademarks of Alliance Semiconductor Corporation. All other trademarks are property of their respective holders.
Contact:
Alliance Semiconductor Corporation
Janine Zanelli, 408/383-4900 (Investor Relations)
investor@alsc.com
Ven Reddy, 408/383-4900 (Product Marketing Manager)
vreddy@alsc.com
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