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To: Mitch Grunes who wrote (4405)1/13/1998 12:17:00 PM
From: Clarksterh  Respond to of 10921
 
Re: <<Does going to 300mm increase wafer area by 2.25? If so, does this directly translate into 2.25 x productivity improvement?>>

I'm no semi engineer, but I would guess that it translates to somewhat more than 2.25 improvement since the ratio of edge to area improves 1.5 times, so you get fewer partial die (percentage wise) and fewer edge related defects (thermal problems etc.).

Clark



To: Mitch Grunes who wrote (4405)1/13/1998 2:10:00 PM
From: Running Bull  Respond to of 10921
 
(Off topic)
Hi Mitch

Are you the former runner from the north who works at a large manufacturer of sticky products?



To: Mitch Grunes who wrote (4405)1/13/1998 5:40:00 PM
From: FJB  Respond to of 10921
 
Mitch,

Most of the estimates I've seen say the move to 300mm will reduce cost per die about 30%. This is after considering raw materials and increased equipment costs. The last quotes I've seen for raw wafers were about $100 for 200mm and close to $1000 for 300mm. Expect the latter to decrease sharply over the next couple years.

Bob


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