Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Micron Only Forum -- Ignore unavailable to you. Want to Upgrade?

To: TREND1 who wrote (26547)	1/14/1998 8:55:00 PM
From: DJBEINO	Read Replies (1) \| Respond to of 53903

NEC Delaying Plans To Make Chips From 300mm Wafers Dow Jones Online News, Wednesday, January 14, 1998 at 14:44 TOKYO -(Dow Jones)- NEC Corp. is considering postponing for at least a year its plans to fabricate microchips from 300 millimeter silicon wafers, company sources said. The company cited a sluggish semiconductor market and high prices for chip-making equipment for such lines, the Nihon Keizai Shimbun reported in its Thursday morning edition. NEC (NIPNY) had planned to ramp up lines for 300mm wafers at a plant in Kanagawa prefecture by the end of fiscal 1998, but has put that off until after 1999. Installation of 300mm wafers processing at a plant in Kumamoto prefecture, planned for 1999, might also be postponed for about a year, the sources added. Prices for 64-megabyte dynamic random access memory, or DRAM, chips have fallen 40% in the last two months, prompting producers to slash investment in plant and equipment. Fabricating chips from 300mm wafers is viewed as crucial to low-cost production of high-density chips such as 1-gigabit DRAMs. Etching chips on 300mm wafers is calculated to be more than 30% cheaper by packing 2.5 times as many chips on a wafer as on the now-standard 200mm wafers. Last month, Hitachi Ltd. said it will postpone opening new facilities at its Naka plant in Ibaraki prefecture for a year. The 150-billion-yen ($1.14 billion) line was scheduled to start commercial fabrication of 64-megabit DRAMs from 300mm wafers in fiscal 1999. Hitachi is also considering reducing capacity at the plant. Toshiba Corp. plans to hold off on building a 130 billion yen plant in Iwate Prefecture, and Mitsubishi Electric Corp. and Fujitsu Ltd. may cut capital spending in the next fiscal year by 10-20%, or 10-30 billion yen. The German federal government and the state of Saxony announce plans this week to spend as much as 370 million marks ($202.9 million) in public funds on development of a "next generation" chip industry based on 300mm wafer technology. Copyright (c) 1998 Dow Jones & Company, Inc.

To: TREND1 who wrote (26547)	1/14/1998 11:56:00 PM
From: Earlie	Respond to of 53903

Larry: I hope you will not view this as being unfriendly, but I prefer to avoid discussing personal trading, primarily as its provision can be inadvertently misconstrued. Call it a personal quirk. Usually when asked, I try to dodge the question through the use of a bit of humour or a hint. I post to both provide and acquire information. I value the give and take as it really makes me rethink my mental point of view. Incidentally, while I visit many sites, I rarely post other than here or on the MB and Mohan threads. I like the civilized tenor and intelligent views found therein. Best, Earlie