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Technology Stocks : Nanophase Technologies (NANX) -- Ignore unavailable to you. Want to Upgrade?

To: Mark Pritikin who wrote (79)	1/18/1998 12:49:00 PM
From: Scrapps	Read Replies (1) \| Respond to of 322

Mark I don't mean to butt in, however, I'm confused about your post. Are you quoting a source or is that an opinion of your own? If it's a quote could you provide a link? Regards, Scrapps

To: Mark Pritikin who wrote (79)	1/18/1998 3:36:00 PM
From: Mel Spivak	Read Replies (2) \| Respond to of 322

Market info on the CMP slurry business that NANX (MOYC/CEM) are selling to the semiconductor industry: Friday January 16, 11:14 am WILLIAMSBURG, Va.--(BUSINESS WIRE)--Jan. 16, 1998--The worldwide market for Chemical Mechanical Polishing (CMP) modules for semiconductor planarization reached $357.1 million in 1997, up 56.1% over 1996, according to the report CMP Technology: Competition, Products, Markets, recently published by The Information Network, a Williamsburg, VA-based market research company. ''The dramatic growth was on the heals of a 40.5% increase in 1996. The worldwide market will grow to $555.6 million in 2000. For 1997, 785 modules were shipped and 863 modules booked, bringing the installed base to 2,007 modules. This represented an increase of 80.0% from 1996,'' notes Dr. Robert N. Castellano, President of The Information Network. ''Polishers from different manufacturer can process from one to six wafers at a time so that a single polisher can have one to six modules. On a unit basis, 300 polishers were shipped in 1997. IPEC (NASDAQ) had a 60.7% share of the 1997 market, followed by SpeedFam , based on number of tools shipped. More than 50% of IPEC/Planar's 182 unit shipments was of the low-priced, single-head design. As a result, IPEC/Planar's share of the market, based on the number of modules, was 43.3%, followed closely by SpeedFam with a 35.9% share. Because of the lower price of its single-head system, IPEC/Planar's share of the 1997 market, based on revenue, was 38.2%, followed closely by SpeedFam at 31.0%. Driven by the needs in the semiconductor industry for planar wafers across the die and across the wafer, CMP has emerged as the technology of choice among semiconductor manufacturers. While other planarization methods are satisfactory on the 0.35 fm and above regime of feature sizes, only CMP offers exemplary capabilities below 0.35 fm. The advantages of CPM are: -- Improved global planarity over non-CMP methods -- Compatible with any conventional dielectric -- Global planarity at 0.35 fm or less feature sizes -- Reduced process steps, particularly lithography -- Can define horizontal and vertical wiring -- Alternative to some defect-prone processes such as etch-back -- Reduced defect density -- Can provide alternative architectures such as damascene The Information Network is a leading consulting and market research company addressing the semiconductor, computer, and telecommunications industries. theinformationnet.com tin@theinformationnet.com The Information Network Dr. Robert N. Castellano, 757/258-3738