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To: Adrian Wu who wrote (4031)	1/23/1998 10:33:00 AM
From: Elmer	Respond to of 6843

<Elmer: The current K6 based on 0.35 micron process has a die size of 188mm^2, the new K6+3D will have a die size of 133mm^2. The die size of the K6-3D will be 88mm^2. All the die sizes are smaller than the corresponding Intel products because AMD uses a 5-layer CMOS process vs. Intel's 4 layers.> From a cost standpoint, what good is a smaller die when your throughput is slower, your yields are poor and your fabs are built with borrowed money? You may get bragging rights but that doesn't help the bottom line. EP

To: Adrian Wu who wrote (4031)	1/23/1998 12:19:00 PM
From: Paul Engel	Respond to of 6843

Adrian - Re: "Have you forgotten about the yield problems Intel had with the Pentium MMX when they were moving to a 0.35 mircon process?" Your facts are, if not completely wrong, at least ENORMOUSLY confused. Intel coverted their wafer fab lines to 0.35 micron process beginning in the spring/early summer of 1995 - without a glitch. The Pentium MMX was introduced in January, 1997 - long after Intel was running the 0.35 micron process in high volumes/high yields in 5 or 6 wafer fabs. The difficulty Intel experienced was in the conversion rate from Pentium to Pentium MMX - with the Pentium MMX bing much larger than the Pentium (140 sq. mm vs. 90 sq. mm). The rapid rate of conversion coupled with the reduced number of die per wafer gave Intel problems until they could convert all their Pentium starts to Pentium MMX as well as bring up more capacity in their production lines. Re: " I doubt you will see a dramatic difference between the PII-333 and the K6-300/100 for the extra $450" No - you will SEE an enormous difference. On Monday of next week you will be able to buy, benchmark and test the Pentium II 333 MHz device. At the same time, you can start to benchmark the K6-300 device - but you'll have to WAIT MONTHS (at least) to get such a device to stick into a PC for you to test it. You will be waiting a long time for establishiung the price/perfromance of the K6-300 chip. Deliverable product is vastly more valuable than undelivered promises. Paul