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To: Dave who wrote (4036)	1/23/1998 12:50:00 PM
From: Paul Engel	Respond to of 6843

Dave - Re: "Didn't Intel have problems fabbing the Pentium Pro? " Initially - 1995/1996 - there were some minor problems in the metallization area that limited yields for a short term. Intel solved these problems in fairly short order. The real problem Intel had/has with the Pentium Pro is the use of two or three die in one PGA package = the Pentium Pro and one (or two) exotic SRAM devices. By placing bare die in the Pentium Pro Dual/Triple cavity PGA package, Intel could not perform full speed/at temperature testing on any of the devices. That meant that one failure in the SRAM could cause the entire Pwntium Pro/PGA module to be scrapped. Hence, Intel came up with SLot/SEC concept - where all components on the SEC are pre-packaged and can be tested - at speed and full temperature extremes. Only KNOWN GOOD DEVICES then make it into the final board assembly process. AMD has acknowledged the soundness of this concept - when they endorsed an as yet non-existent Slot A configuration for their upcoming K7. By the time that arrives, Intel will have had 2 years experience in the design/manufacture of these slot/SEC modules. Paul