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To: THE WATSONYOUTH who wrote (35672)	3/7/2020 5:29:42 PM
From: Vattila	Respond to of 73495

Good read. I am particularly excited about the unified memory and cache-coherent features of 3rd generation Infinity Architecture, as well as their X3D packaging technology taking us into the era of heterogenous architecture and interposer packaging, respectively. I think Gabriel Loh is one of AMD's unsung heros. He and his colleagues have been researching heterogeneous systems, interposer and stacking for over 10 years. He is currently a Senior Fellow at AMD. Like Mike Clark was promoted to Corporate Fellow for his contributions to the Zen architecture, look for Loh to be promoted as well in the coming years. AMD has strong research and engineering talent, it seems. Sam Naffziger is also an impressive Corporate Fellow with lots of contributions to power-efficient microarchitecture, which has allowed AMD to stay competitive and survive even when behind on process. ieeexplore.ieee.org electronicdesign.com ir.amd.com Meanwhile we hear about brain drain and low morale among the engineering staff at Intel. But I guess, the Koduri & Keller duo is doing their best to change that.