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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Petz who wrote (28133)1/27/1998 1:36:00 AM
From: Yousef  Read Replies (1) | Respond to of 1575539
 
John,

Re: "Right, Paul, I was thinking of C4 bumps, not Local Interconnect"

Just to be accurate ... Intel is using C4 "flip chip" packaging for many
of their .25um parts. You are correct, John ... this does provide many
more I/O than with regular bond pads. So, AMD does not have an advantage
in that technology.

Make It So,
Yousef



To: Petz who wrote (28133)1/27/1998 4:38:00 AM
From: greg nus  Respond to of 1575539
 
Petz, Dec to cpq should stop all those nonsensicaly stories about cpq buying amd. If cpq wanted chips it would not have let dec sell alpha to intc. Amd would stil have a shot with txn and Mot.


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