Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Qualcomm Moderated Thread - please read rules before posting -- Ignore unavailable to you. Want to Upgrade?

To: waitwatchwander who wrote (164840)	10/24/2020 1:45:52 PM
From: Jim Mullens	1 Recommendation Recommended By Lance Bredvold Read Replies (1) \| Respond to of 196961

WWW, re: iPhone 12 mmW supplier- QCOM v USI ............................. With the news of iPhone 12 having a USI moniker on their mmwave antenna package it's all still a bit confusing. Thanks for the info on QCOM and USI (ASE) cooperation. I haven’t found a whole lot of info on their website (19k employees) that indicates much if any experience in RF components / wireless design (except antennas) including power amplifiers, filters, envelope tracking, transceivers. This recent (sept 2020) news item is also interesting as it references another tie-up with QCOM with SiP orders for Wi-Fi 6E modules, however the rest of the article is behind a paywall. USI obtains new SiP orders for Wi-Fi 6E modules digitimes.com Sep 01, 2020 · USI remains focused on modular, miniaturized designs (May 6, 2019) Qualcomm, USI and Asustek team up in Brazil (Mar 15, 2019) USI to build new plant in China (Jan 29, 2019) Below is their info on miniaturization- Antenna on Package. Perhaps as you mentioned they still work with QCOM, using QCOM’s RF components and package them with their antenna on a smaller package for the iPhone using the USI part number. usiglobal.com Miniaturization XY Area Reduction Encapsulation Shielding Antenna on Package Miniaturization becomes much more important, especially for mobile devices, Internet of Things (IoT) and wearable electronics. By integration of these miniaturization solutions, most electronic systems can reduce size to meet market requirements. Miniaturization brings the following benefits. Size (XY) reduction to have more space for battery and integrate more functions Reduce thickness (Z) and weight for stylish ID design Reduce final assembly, test & pack difficulty Improve signal integrity EMI shielding interference Speed up development Better reliability-humidity and mechanical Better logistics and inventory management