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To: shane forbes who wrote (4665)2/2/1998 8:00:00 AM
From: Mason Barge  Respond to of 10921
 
OK, here's a roadmap of current thinking:

<<Meanwhile, IC companies that primarily produce logic chips, such as ASICs and microprocessors, are more interested in shrinking their process technology and moving to copper interconnects, which offer smaller die sizes, faster device speeds, and improved yields. Until DRAM makers spring for the initial investments in 300 mm, logic manufacturers are less likely to move forward, observers said.>>

So, everyone seems to think 300mm is dead in the water and all the money is going into shrinking architecture. Der Toro says cutting-edge equipment may be up 50% this year.

Personally, I'm listening to them.